Techblick is introducing its article series, which will highlight various innovation trends in the diverse area of printed, hybrid, in-mold, and 3D electronics. Techblick’s goal is to demonstrate progress and state-of-the-art on various fronts ranging from R2R on-paper printing to thin ICs to conductive inks to stretchable substrates to in-mold electronics and beyond. Here is a sample of articles: • Towards thin and flexible logic • 32-bit natively flexible ARM processor • Electrohydrodynamic p...